| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 3GBJ306 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| 2GBJ10 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| DB157 | TOS/熙隆半导体 | DBM | 25+ | 1000000 | 2025-12-31 | |||
| 2W10 | TOS/熙隆半导体 | WOB | 25+ | 10000 | 2025-12-31 | |||
| B500R | DIOTEC/国产 | 25+ | 1000 | 2025-12-31 | ||||
| D2SB100 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| D2SB60 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| D15XB80 | TOS/熙隆半导体 | 6GBJ | 25+ | 10000 | 2025-12-31 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 3GBJ306 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| 2GBJ10 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| DB157 | TOS/熙隆半导体 | DBM | 25+ | 1000000 | 2025-12-31 | |||
| 2W10 | TOS/熙隆半导体 | WOB | 25+ | 10000 | 2025-12-31 | |||
| B500R | DIOTEC/国产 | 25+ | 1000 | 2025-12-31 | ||||
| D2SB100 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| D2SB60 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2025-12-31 | |||
| D15XB80 | TOS/熙隆半导体 | 6GBJ | 25+ | 10000 | 2025-12-31 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MBR3045FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBRF1045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBR10200FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBRF3045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBRF2045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBRF30100CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 | |||
| MBR20100FCT | XL/熙隆半导体 | TO-220F | 25+ | 50000 | 2025-12-31 | |||
| MBR30200FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2025-12-31 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DB205S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DB103S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| 3KBP10M | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2025-12-31 | |||
| 2KBP10M | TOS/熙隆半导体 | KBPM | 25+ | 10000 | 2025-12-31 | |||
| DB152S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DB151S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DBL105G | TOS/熙隆半导体 | DBL | 25+ | 10000 | 2025-12-31 | |||
| DB301S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DB205S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DB103S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| 3KBP10M | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2025-12-31 | |||
| 2KBP10M | TOS/熙隆半导体 | KBPM | 25+ | 10000 | 2025-12-31 | |||
| DB152S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DB151S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 | |||
| DBL105G | TOS/熙隆半导体 | DBL | 25+ | 10000 | 2025-12-31 | |||
| DB301S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2025-12-31 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SS520 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2025-12-31 | |||
| SS26 | TOS/熙隆半导体 | SMA/SMAF | 25+ | 888888 | 2025-12-31 | |||
| SS16 | TOS/熙隆半导体 | 25+ | 888888 | 2025-12-31 | ||||
| SS310 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2025-12-31 | |||
| SS3200 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2025-12-31 | |||
| SS14 | TOS/熙隆半导体 | 25+ | 888888 | 2025-12-31 | ||||
| SS56 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2025-12-31 | |||
| SS210 | TOS/熙隆半导体 | 25+ | 888888 | 2025-12-31 |