型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DB157 | TOS/SEP | DBM | 23+ | 1000000 | 2024-04-20 | |||
DF1510S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
2W10 | TOS/SEP | WOB | 23+ | 10000 | 2024-04-20 | |||
B500R | DIOTEC | 23+ | 1000 | 2024-04-20 | ||||
D2SB100 | TOS/SEP | GBL | 23+ | 10000 | 2024-04-20 | |||
D2SB60 | TOS/SEP | GBL | 23+ | 10000 | 2024-04-20 | |||
DI106S | TOS/熙隆半导体 | SMD | 23+ | 10000 | 2024-04-20 | |||
D15XB80 | TOS/SHINDENGEN | 6GBJ | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DB157 | TOS/SEP | DBM | 23+ | 1000000 | 2024-04-20 | |||
DF1510S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
2W10 | TOS/SEP | WOB | 23+ | 10000 | 2024-04-20 | |||
B500R | DIOTEC | 23+ | 1000 | 2024-04-20 | ||||
D2SB100 | TOS/SEP | GBL | 23+ | 10000 | 2024-04-20 | |||
D2SB60 | TOS/SEP | GBL | 23+ | 10000 | 2024-04-20 | |||
DI106S | TOS/熙隆半导体 | SMD | 23+ | 10000 | 2024-04-20 | |||
D15XB80 | TOS/SHINDENGEN | 6GBJ | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
D2UB60 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D3K810 | TOS/熙隆半导体 | D3K | 24+ | 10000 | 2024-04-20 | |||
D3K610 | TOS/熙隆半导体 | D3K | 24+ | 10000 | 2024-04-20 | |||
D3K410 | TOS/熙隆半导体 | D3K | 24+ | 10000 | 2024-04-20 | |||
D3K310 | TOS/熙隆半导体 | D3K | 24+ | 10000 | 2024-04-20 | |||
2W10G | TOS/SEP | WOB | 23+ | 10000 | 2024-04-20 | |||
DBF410 | TOS/熙隆半导体 | DBF | 24+ | 30000 | 2024-04-20 | |||
GBJ1510/GBJ2510/GBJ3510/GBJ5010 | TOS/SEP | 6GBJ | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
FMSB30M/RMSB30M | TOS/熙隆半导体 | MSB | 24+ | 100000 | 2024-04-20 | |||
FMSB40M/RMSB40M | TOS/熙隆半导体 | MSB | 24+ | 100000 | 2024-04-20 | |||
FMB40M/RMSB40M | TOS/中性TOS/熙隆半导体/中性 | MSB | 24+ | 100000 | 2024-04-20 | |||
FMB30M/RMSB30M | TOS/中性TOS/熙隆半导体/中性 | MSB | 24+ | 100000 | 2024-04-20 | |||
FBS210 | TOS/熙隆半导体/中性 | ABS | 24+ | 10000 | 2024-04-20 | |||
DXK210 | TOS/熙隆半导体 | DXK | 23+ | 10000 | 2024-04-20 | |||
DXK310 | TOS/熙隆半导体 | DXK | 23+ | 10000 | 2024-04-20 | |||
DXK410 | TOS/熙隆半导体 | DXK | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DBLS152G | TOS/熙隆半导体 | 23+ | 10000 | 2024-04-20 | ||||
BR5010 | TOS/SEP | GBPC | 23+ | 10000 | 2024-04-20 | |||
26MT160A | 国产 | 23+ | 5000 | 2024-04-20 | ||||
DBL105G | TOS/熙隆半导体 | DBM | 23+ | 10000 | 2024-04-20 | |||
DB301S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
36MT120A | 国产 | 23+ | 5000 | 2024-04-20 | ||||
DF202S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
DB106 | TOS/SEP | DBM | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
DBLS152G | TOS/熙隆半导体 | 23+ | 10000 | 2024-04-20 | ||||
BR5010 | TOS/SEP | GBPC | 23+ | 10000 | 2024-04-20 | |||
26MT160A | 国产 | 23+ | 5000 | 2024-04-20 | ||||
DBL105G | TOS/熙隆半导体 | DBM | 23+ | 10000 | 2024-04-20 | |||
DB301S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
36MT120A | 国产 | 23+ | 5000 | 2024-04-20 | ||||
DF202S | TOS/SEP | DBS | 23+ | 10000 | 2024-04-20 | |||
DB106 | TOS/SEP | DBM | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
D2UB20 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D2UB40 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D3UB20 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D3UB40 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D4UB20 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D4UB40 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D6UB20 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 | ||||
D6UB40 | TOS/熙隆半导体 | D3K | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
FABS210 | TOS/熙隆半导体 | ABS | 24+ | 10000 | 2024-04-20 | |||
EGBJ1506/GBJ1506SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
EGBJ2506/GBJ2506SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
EGBJ2006/GBJ2006SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
EGBJ3506/GBJ3506SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
EGBJ5006/GBJ5006SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
EGBJ1006/GBJ1006SF | TOS/熙隆半导体 | 6GBJ | 24+ | 10000 | 2024-04-20 | |||
WRABS20M | 沃尔德软桥/WORLD | ABS | 23+ | 10000 | 2024-04-20 |
型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
---|---|---|---|---|---|---|---|---|
MB24F | TOS/熙隆半导体 | MBF | 23+ | 10000 | 2024-04-20 | |||
MB26F | TOS/熙隆半导体 | MBF | 23+ | 10000 | 2024-04-20 | |||
MB210F | TOS/熙隆半导体 | MBF | 23+ | 10000 | 2024-04-20 | |||
MB14F MB16F MB110F MB24F MB26F MB210F | TOS/熙隆半导体 | MBF | 24+ | 10000 | 2024-04-20 |