| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RHBS610/RHBS810/RHBS1010 | TOS/熙隆半导体 | HBS | 25+ | 10000 | 2026-04-16 | |||
| HBS610/HBS810/HBS1010 | TOS/熙隆半导体 | HBS | 25+ | 15000 | 2026-04-16 | ![]() |
||
| RABS210/FBS210 | TOS/熙隆半导体 | ABS | 25+ | 100000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RHBS610/RHBS810/RHBS1010 | TOS/熙隆半导体 | HBS | 25+ | 10000 | 2026-04-16 | |||
| HBS610/HBS810/HBS1010 | TOS/熙隆半导体 | HBS | 25+ | 15000 | 2026-04-16 | ![]() |
||
| RABS210/FBS210 | TOS/熙隆半导体 | ABS | 25+ | 100000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KBU1506 | TOS/熙隆半导体 | KBU | 25+ | 10000 | 2026-04-16 | |||
| KBP206 | TOS/熙隆半导体 | KBP | 25+ | 100000 | 2026-04-16 | |||
| GBU10J | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBU808 | TOS/熙隆半导体 | KBU | 25+ | 100000 | 2026-04-16 | |||
| D2SB40 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2026-04-16 | |||
| RS608 | TOS/熙隆半导体 | RS-6 | 25+ | 10000 | 2026-04-16 | |||
| GBL505 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2026-04-16 | |||
| GBPC1504W | TOS/熙隆半导体 | 25+ | 10000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KBU1506 | TOS/熙隆半导体 | KBU | 25+ | 10000 | 2026-04-16 | |||
| KBP206 | TOS/熙隆半导体 | KBP | 25+ | 100000 | 2026-04-16 | |||
| GBU10J | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBU808 | TOS/熙隆半导体 | KBU | 25+ | 100000 | 2026-04-16 | |||
| D2SB40 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2026-04-16 | |||
| RS608 | TOS/熙隆半导体 | RS-6 | 25+ | 10000 | 2026-04-16 | |||
| GBL505 | TOS/熙隆半导体 | GBL | 25+ | 10000 | 2026-04-16 | |||
| GBPC1504W | TOS/熙隆半导体 | 25+ | 10000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MBR30100FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBR30200FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBR20100FCT | XL/熙隆半导体 | TO-220F | 25+ | 50000 | 2026-04-16 | |||
| MBRF30100CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBRF2045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBRF3045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBR10200FCT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 | |||
| MBRF1045CT | XL/熙隆半导体 | TO-220F | 25+ | 10000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ES1J | TOS/熙隆半导体 | SMA | 26+ | 100000 | 2026-04-16 | |||
| ES2J | TOS/熙隆半导体 | SMA | 26+ | 100000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RHBS1010 | TOS/熙隆半导体 | HBS | 25+ | 100000 | 2026-04-16 | ![]() |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| EM520 | TOS/熙隆半导体 | DO-214AA(SMB) | 26+ | 100000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| GBU1001 | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBP04M | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2026-04-16 | |||
| DB106 | TOS/熙隆半导体 | DBM | 25+ | 10000 | 2026-04-16 | |||
| KBJ1008 | TOS/熙隆半导体 | 4KBJ | 25+ | 10000 | 2026-04-16 | |||
| RS407L | TOS/熙隆半导体 | RS-4 | 25+ | 10000 | 2026-04-16 | |||
| GBU35005 | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBP302 | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2026-04-16 | |||
| DF201S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| GBU1001 | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBP04M | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2026-04-16 | |||
| DB106 | TOS/熙隆半导体 | DBM | 25+ | 10000 | 2026-04-16 | |||
| KBJ1008 | TOS/熙隆半导体 | 4KBJ | 25+ | 10000 | 2026-04-16 | |||
| RS407L | TOS/熙隆半导体 | RS-4 | 25+ | 10000 | 2026-04-16 | |||
| GBU35005 | TOS/熙隆半导体 | GBU | 25+ | 10000 | 2026-04-16 | |||
| KBP302 | TOS/熙隆半导体 | KBP | 25+ | 10000 | 2026-04-16 | |||
| DF201S | TOS/熙隆半导体 | DBS | 25+ | 10000 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SS520 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2026-04-16 | |||
| SS26 | TOS/熙隆半导体 | SMA/SMAF | 25+ | 888888 | 2026-04-16 | |||
| SS16 | TOS/熙隆半导体 | 25+ | 888888 | 2026-04-16 | ||||
| SS310 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2026-04-16 | |||
| SS3200 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2026-04-16 | |||
| SS14 | TOS/熙隆半导体 | 25+ | 888888 | 2026-04-16 | ||||
| SS56 | TOS/熙隆半导体 | SMA/B/C | 25+ | 888888 | 2026-04-16 | |||
| SS210 | TOS/熙隆半导体 | 25+ | 888888 | 2026-04-16 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RMSB40M/FMSB40M/FMB40M | TOS/熙隆半导体 | MSB | 25+ | 1000000 | 2026-04-16 | |||
| D3K803SF | TOS/熙隆半导体 | D3K | 25+ | 10000 | 2026-04-16 |